| 摘要 |
PURPOSE: To enhance the cooling efficiency and the cooling capability of an electronic component more sharply than in conventional cases regarding a cooling device, for the electronic component, which is used to cool the electronic component such as a rectifier diode or the like which generates heat. CONSTITUTION: A cooling device is constituted in such a way that a header tank 35 in which a refrigerant is housed is formed on the other face of a cold plate 31 in which an electronic component 33 is mounted on one face, that a plurality of loop pipe passages in which the refrigerant is circulated are connected to the header tank 35 and that the loop pipe passages are arranged nearly parallel to the cold plate 31. In addition, the cooling device is constituted in such a way that the heat dissipating area of the pipe passage on the far side from the cold plate 31 in the loop pipe passages is made larger than the heat dissipating area of the pipe passage on the rear side. |
