| 摘要 |
PURPOSE: To simplify the connecting operation of a semiconductor circuit on the side of a lid to the side of a container body when the semiconductor circuit is mounted on the side of the lid and to promote the high density of a mounting operation in a semiconductor hermetically sealed package in which the container body with the mounted semiconductor circuit is sealed with the lid. CONSTITUTION: A semiconductor circuit is mounted on the inside of a lid 12. A group of pads 26, for connection, which connect a circuit on the side of a container body 1 0 to the circuit on the side of the lid are formed on opposite faces 22 formed along parts near the peripheral edge of the lid and the container body 10 in such a way that they are faced so as to be close to each other. A ring-shaped sealing pad 30 is formed in a position surrounding the group of pads 26 for connection from the outside in such a way that it is faced with the group of pads. The group of pads on the side of the lid and the side of the container body are soldered and connected. The sealing pad is soldered and sealed. As solder 48 which is used for bonding, Au-Sn eutectic alloy solder is suitable, and it is desirable that the container body 10 and the lid 12 are made of a ceramic such as alumina or the like. |
