| 摘要 |
PURPOSE: To achieve a lowering of cost and higher yields with the elimination of a process by packing a bump into through holes of a base material made of a soluble material to be connected to a specified position of a wire film. CONSTITUTION: A wire film 15 is formed in a specified pattern on one surface of a soluble base material 14 while through holes 17 are made by laser abrasion at positions corresponding to a pad 2 of a semiconductor chip 1 from the other surface side. Then, a solder paste is packed into the through holes 17 by a screen printing and melt by heating to form bump parts 18 thereby building a burn-in inspection substrate 19. The chip 1 is placed on the substrate 19 so that the pad 2 matches the bump parts 18 of the substrate 19 and heated to join the bump parts 18 on the pad 2. Thereafter, the chip is connected to a measuring device by a lead 16 to judge the quality thereof by inspecting a burn-in or the like. As a result of the inspection, when the chip is determined to be accepted, the soluble base material 14 and the wire film 15 are removed by using a solvent and the chip 1 is kept with bumps 20. |
