| 摘要 |
PURPOSE: To provide a package for housing a semiconductor element, which can exert a sufficiently high noise reducing effect even when its size and weight are not increased. CONSTITUTION: A package for housing a semiconductor element is provided with an insulating substrate 1 which is constituted of multiple insulating layers laminated upon another and has a mounting section 1a for a semiconductor element 3, pads 5a and 5b to which a grounding electrode and a power supply electrode formed in the circumference of the mounting section 1a are respectively connected, and a pair of pads 8a and 8b for connecting capacitor which are formed on the surface of the substrate 1 and respectively connected to the pads 5a and 5b and to which the electrodes of a chip capacitor 9 are connected. In addition, a grounding plane 10 and a power supply plane 11 are buried in the substrate 1 with an insulating layer in between so that the planes 10 and 11 can be faced to each other and electrically connected to the pads 5a and 5b in the circumference of the mounting section 1a of the substrate 1. |
