| 摘要 |
PURPOSE: To prevent short circuit between chips by arranging a plurality of light emitting diodes linearly on a semiconductor substrate and forming insulating parts at the opposite ends in the arranging direction of light emission diode array chip provided with a lead-out electrode. CONSTITUTION: A wafer 1 is coated with silica coating glass and dried thus forming a glass film 4. The wafer 1 is cut off at each scribe area 2. At that time, glass 4a is left at the opposite ends of a substrate 5 for an LED array chip. The substrate 5 is then heat treated at 350-450 deg.C which is higher than the drying temperature for the silica coating glass film 4. The residual glass 4a is fluidized and flows toward the end face 6. It is cooled and solidified to form an insulating part 7. Since the LED array chip is insulated at the opposite ends in the arranging direction, electrical short circuit can be prevented even if the LED array chips touch each other. |
