| 摘要 |
PURPOSE: To improve the reliability of a semiconductor device having a module structure by effectively suppressing a surface voltage by forming a capacitor for snubber in a package. CONSTITUTION: After a first conductive film 11 is formed on a first insulating film 4 which is the insulating film of an aluminum insulating substrate 3, a second insulating film 5 is formed on the first conductive film 11 and a second conductive film 12, a third conductive film 13, and a fourth conductive film 14 are successively formed on the second insulating film 5. Then a first terminal 21, a second terminal 22, and a third terminal 23 are respectively connected to the fourth, second, and third conductive films 14, 12, and 13. The interval between the first and third conductive films 11 and 13 is made narrower than that between the first and second conductive films 11 and 12. |
