| 摘要 |
PURPOSE: To form a high-fineness wiring by a method wherein after organic boards are laminated, a through hole and a non-through hole are bored in the outermost layer of the organic boards, the inner walls of these holes are coated with a physical absorbant, then, after a wiring is formed on the outermost layer, the inner walls of the holes are plated to form the through hole and the non-through hole. CONSTITUTION: A wiring 2 is formed on the copper foil surface of each epoxy resin glass substrate copper-clad laminated board 1. After that, epoxy resin glass cloth base material prepregs 3 are held between the laminated boards 1 and an electrolytic copper foil 4 is formed on the outermost layer of the laminated boards 1 to obtain a multilayer wiring board. Then, a through hole 5 and a non-through hole 5' are bored in this multilayer wiring board and moreover, the inner walls of the holes 5 and 5' are coated with a physical absorbant to obtain conductive polymers 6 on the inner walls of the holes 5 and 5'. Then, a wiring is formed on the outermost layer of this multilayer wiring board with the polymers 6. Then, a gold-plated film is precipitated on the pattern 2 formed with the wiring and conductive polymer coverings 6 using a watt bath to obtain a multilayer wiring board 8. |
