| 摘要 |
FIELD: adhesives. SUBSTANCE: adhesive formulation contains at least one polyfunctional epoxide resin; and a composition obtained from at least one bifunctional epoxide resin and at least one compound of general formula R-(G), where R is aromatic, alicyclic, or heterocyclic group, and G is a functional group selected from the group of residues including COOH, O, SH,where Ris hydrocarbon group, Ris alkylene or alkylidene group, m number in the range from 1 to about 4, n number lying in the range from 3 to a number of H atoms substituted by R; on condition that, when at least one G is NHor RNH, n may also be 2, and, when at least one G is (NHC(-NH))NH, n may also be 2 and 1. Invention also refers to copper foil at least one side of which is covered with above said adhesive formulation to enhance adhesion between foil and dielectric substrate. Also provided are lamellar materials containing copper foil, dielectric substrate, and adhesion layer consisting of the above said adhesion formulation placed between foil and substrate and being glued to both. EFFECT: improved performance of adhesive formulation. |
