| 摘要 |
FIELD: manufacture of integrated-circuit microdisplacement transducers, electronic safety systems for transport, navigations system and moving-object observing facilities. SUBSTANCE: microdisplacement transducer is sensing element made in the form of cantilever within semiconductor material substrate with seismic masses and additional semiconductor substrate with photosensing elements formed within its material and arranged along displacement of sensing element. EFFECT: improved design. 1 cl, 2 dwg |
