发明名称 APPARATUS FOR MONITORING BONDED STATE OF RUBBER OF TIRE-MOLDING MACHINE
摘要 PURPOSE: To highly accurately measure a size of a seal or lap, automatize process, improve a working efficiency, improve the product quality, save labor and drive fully automatically. CONSTITUTION: A tire rubber 2 is fitted and molded on a drum 1 of a tire- molding machine driven by a motor 22. A size of a gap or lap at a bonded part of the molded tire rubber 2 is detected by a displacement sensor (laser displacement sensor) 24, and the obtained detection signal is input to an image- processing device 30 through an amplifier 25 and a comparator 26. A state of the bonded part of the tire rubber 2 is photographed by monitoring TV cameras 27, 28, 29, and the obtained image signals are input to the image- processing device 30. The image signals are processed at the image-processing device 30 and then output to an operating device 31. The size of the gap or lap of the tire rubber is operated at the device 31, which is output to a comparator 32. When the size is not smaller than a regulated value, the comparator 32 outputs a stop instruction to a motor rotation-controlling device 33, whereby the motor 22 is stopped by the rotation-controlling device 33.
申请公布号 JPH095246(A) 申请公布日期 1997.01.10
申请号 JP19950153208 申请日期 1995.06.20
申请人 MITSUBISHI HEAVY IND LTD 发明人 IIDA MASAMI;NONAKA MITSUYUKI
分类号 G01N21/88;G01N21/952;G06T1/00;G06T7/00 主分类号 G01N21/88
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