| 摘要 |
PURPOSE: To form a projected electrode in a simple process by wire-bonding a gold wire to an electrode, cutting it, wire-bonding another metallic wire thereon, cutting the metallic wire and thereafter making both bonding parts integral by heating and fusing. CONSTITUTION: A projected electrode 28 of a semiconductor chip 10 to be connected to a circuit bonding pattern of a board by a flip chip method is formed. In the process, a gold wire 14 is wire-bonded to an electrode 12 of the semiconductor chip 10, the gold wire 14 is cut immediately above a bonding part 20 thereof and a ball-like bonding part 20 is left on the electrode 12. Then, another metallic wire 24 is wire-bonded on the bonding part 20 of the gold wire, the metallic wire 24 is cut immediately above the bonding part 26 and a ball-like bonding part 26 is formed in stack. Thereafter, both bonding parts 20, 26 are made integral by heating and fusing. For example, the metallic wire 24 is a tin wire. |
