发明名称 POLISHING APPARATUS AND POLISHING METHOD USING IT
摘要 PURPOSE: To ensure uniform polishing the surface of a substrate and between substrates by disposing a plurality of polishing means in which distances of rotary boars from the center are different from each other, and a radius of the rotary board covers a locus drawn on the rotary board upon polishing. CONSTITUTION: Polishing cloth 1 is sticked over a rotary board 2, and a substrate 4 of a substrate holder 5 is slidably held on the polishing cloth 1 in close contact with the same. First, second, and third polishing heads 6, 7, and 8 are disposed in order from the center of the rotary board 2 to the outer periphery of the same at a predetermined position on the upstream side of the substrate holder 5. A slurry like polishing agent 3 is supplied onto the polishing cloth 1 between the first polishing head 6 and the second polishing head 7 and between the second polishing head 7 and the third polishing head 8. The entire surface of the polishing cloth 1 is polished with the three polishing heads 6 to 8 such that a radius of the rotary board 2 covers loci T1 to T3 drawn by the bottom surface of the rotary board by the rotation of the rotary board 2. Accordingly, uniform polishing is ensured.
申请公布号 JPH097982(A) 申请公布日期 1997.01.10
申请号 JP19950150036 申请日期 1995.06.16
申请人 SONY CORP 发明人 NAKAJIMA HIDEHARU
分类号 H01L21/304;B24B53/017 主分类号 H01L21/304
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