| 摘要 |
The chip of an invention for an electronic circuit card comprises a semiconductor microplate having an active face provided with contact pads and on which projections are formed of different heights. The active face of the microplate is coated, at least in part, in a layer of insulating material having a thickness that is greater than or equal to the height of the highest projection, said layer being shaped so as to give free access to the contact pads and having an outer face parallel to the periphery of the active face of the microplate. The layer enables the chip to be implanted in a card body while remaining accurately parallel thereto, which is essential to enable conductive tracks to be made subsequently by silk-screen printing./! |
