| 摘要 |
PURPOSE: To provide a leadless-chip-carrier-package semiconductor device which prevents an edge through-hole electrode from being stripped in a production operation, whose density is high, which is excellent in a mounting property and which uses a printed-circuit board. CONSTITUTION: A dummy conductor pattern 10 is formed in the inner layer of a substrate 1 so as to come into contact with an edge through-hole electrode 7. Thereby, when a through hole is pressed and cut to be half, it is possible to prevent the edge through-hole electrode 7 from being damaged. Especially, the substrate 1 is thick, and the edge through-hole electrode 7 which is long can be manufactured without any problem. |
