| 发明名称 |
SOLDER, AND SOLDERED ELECTRONIC COMPONENT AND ELECTRONIC CIRCUIT BOARD |
| 摘要 |
<p>A soldering material, electronic component improves bonding stength and electronic circuit board. Solder wettability is improved to increase bonding strength and the tombstone phenomenon is prevented by gradual melting of solder. To inprove soldering reliability, a coating of indium (In) or bismuth (Bi) is applied to a soldering material, the lead frame and electrodes of an electronic component, and a copper (Cu) land of an electronic circuit board.</p> |
| 申请公布号 |
WO9700753(A1) |
申请公布日期 |
1997.01.09 |
| 申请号 |
WO1996JP01680 |
申请日期 |
1996.06.19 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;YAMAGUCHI, ATSUSHI;SUETSUGU, KENICHIRO;FUKUSHIMA, TETSUO;FURUSAWA, AKIO |
发明人 |
YAMAGUCHI, ATSUSHI;SUETSUGU, KENICHIRO;FUKUSHIMA, TETSUO;FURUSAWA, AKIO |
| 分类号 |
B23K35/02;B23K35/14;B23K35/26;H01L23/495;H05K3/24;H05K3/34;(IPC1-7):B23K35/14;H01L23/50;B23K35/22 |
主分类号 |
B23K35/02 |
| 代理机构 |
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