Leistungshalbleiteranordnung, geeignet zur Automation der Herstellung

摘要

The feature of the construction of this invention lies in a direct bond copper (DBC) plate. That is, a first Cu plate (11) on which a semiconductor pellet (15) is formed is fixed on the ceramic plate (12) to continuously extend from the front surface of the ceramic plate (12) to the rear surface thereof via one side surface thereof. Second Cu plates (13) serving as electrodes of the semiconductor pellet (15) are fixed on both sides of the first Cu plate (11) on the surface of the ceramic plate (12) on which the semiconductor pellet (15) is disposed. Electrode pads (17) formed on the semiconductor pellet (15) fixed on the first Cu plate (11) are electrically connected to the second Cu plates by means of bonding wires (18). Since the first Cu plate (11) is continuously formed on the rear surface of the ceramic plate (12) which is opposite to the surface on which the semiconductor pellet (15) is mounted, the fixation surface of the semiconductor pellet is electrically connected to a heat sink plate (19).