Contact structure for electrically connecting a testing board and die

摘要

An integrated circuit testing board (10) has a plurality of annular contacts (16) protruding from its surface (18). Each contact has an opening (24) into which a deformable, conductive solder bump (20) is swaged. The bumps are disposed on a die (22) containing an integrated circuit. The swaging of the bumps provides increased compliance to accommodate non-planarity between the die and the testing board. Alternatively, the bumps are disposed on the testing board, and the annular contacts are disposed on the die. <IMAGE>