| 摘要 |
PURPOSE: To provide a cutting method and its device for a nonmetallic material substrate not generating any defect in the cut surface after cutting. CONSTITUTION: In the cutting method of the nonmetallic material substrate which cuts the nonmetallic material substrate 20 for working by relatively transferring a CO2 laser light to the substrate 20, the nonmetallic material substrate 20 is cut with the first CO2 laser light L4 and at the same time the secondary working such as a radius surface for the cut surface, etc., is performed by irradiating the cut surface with the second CO2 laser light L5. |
