发明名称 |
Process for dissipating heat from a semiconductor package |
摘要 |
A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.
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申请公布号 |
US5590462(A) |
申请公布日期 |
1997.01.07 |
申请号 |
US19950449675 |
申请日期 |
1995.05.24 |
申请人 |
SGS-THOMSON MICROELECTRONICS S.R.L.;SGS-THOMSON MICROELECTRONICS, INC. |
发明人 |
HUNDT, MICHAEL J.;COGNETTI, CARLO |
分类号 |
H01L23/367;H01L23/373;H05K1/02;H05K3/30;H05K3/40;(IPC1-7):H05K3/34 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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