| 摘要 |
PURPOSE: To obtain an epoxy resin compsn. which is hardly affected by moisture absorption and is esp. excellent in moisture resistance after solder dipping and in resistance to soldering heat by compounding a specific epoxy resin, a specific phenol resin, and a specified amt. of an inorg. filler. CONSTITUTION: This resin compsn. contains as the essential components an epoxy resin represented by formula I (wherein R<1> is Cj H2j+1 ; R<2> is Ck H2k+1 ; R<3> is Cl H2l+1 ; R<4> is Cm H2m+1 ; and (j), (k), (l), (m), and (n) are each 0 or higher), a phenol resin represented by formula II (wherein R<5> is R<1> ; and R<6> is R<2> ), and an inorg. filler, pref. a silica powder having an average particle size of 30μm or lower, in an amt. of 50-95wt.% of the resin compsn.
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