发明名称 CONDUCTOR PASTE COMPOSITION AND ITS CURED MATERIAL
摘要 PURPOSE: To obtain the subject composition comprising a specific reaction product, a diluent, a photopolymerization initiator and conductor powder, excellent in developing properties in formation of a circuit pattern by ultraviolet rays and in pattern accuracy after development, low in the resistance value of the circuit pattern and excellent in adhesivity. CONSTITUTION: This conductor paste composition comprises (A) a reaction product of a copolymer of styrene and maleic anhydride and an OH-containing mono(meth)acrylate such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth) acrylate, etc., (B) a diluent such as ethyl (meth)acrylate, an (α-alkyl) styrene, etc., (C) a photopolymerization initiator such as 2,4-diethylthioxanthone, benzyldimethylketal, etc., and (D) conductor powder such as copper powder, silver powder, palladium powder, etc.
申请公布号 JPH093283(A) 申请公布日期 1997.01.07
申请号 JP19950172982 申请日期 1995.06.16
申请人 NIPPON KAYAKU CO LTD 发明人 HINOKUCHI KAZUHIKO;YOKOSHIMA MINORU
分类号 C08K3/08;C08F2/00;C08F2/48;C08F290/00;C08F299/00;C08K3/00;C08L25/08;C08L35/00;H01B1/22;H05K1/09;(IPC1-7):C08L25/08 主分类号 C08K3/08
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