This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177 DEG C for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.
申请公布号
WO9700339(A1)
申请公布日期
1997.01.03
申请号
WO1996US08032
申请日期
1996.05.30
申请人
ELECTROCOPPER PRODUCTS LIMITED
发明人
CLOUSER, SIDNEY, J.;WIECHMANN, RUDOLF;SCHNEIDER, BERND;BOHMLER, ULRIKE;APPERSON, R., DUANE;FEDOR, ROBERT, J.;YOUNG, SHARON, K.;WRIGHT, ROGER, N.;KOHUT, STEPHEN, J.;ENOS, SUSAN, S.