发明名称 GROUND PLANE ROUTING
摘要 <p>A flexible circuit construction allows solder balls (26) to be mass reflow attached to the ground plane (22) of a double-sided flexible circuit (20) by providing a first via (30) which is separate from the remainder of the ground plane (22), but which is electrically connected to the ground plane (22) through a second via (38) at a distance from the first via (30) by a circuit trace (36) on the side of the flexible circuit (20) opposite the ground plane (22).</p>
申请公布号 WO1997000599(A1) 申请公布日期 1997.01.03
申请号 US1996006292 申请日期 1996.05.03
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