Secondary contact adhesion or self-bonding in cured liquid injection molding silicone compositions is reduced by the inclusion in the composition of a self-bonding inhibitor compound selected from the group consisting of phenyl fluids, titanate esters, and silicate esters. The phenyl fluid is of formula MDD'M: where M is (R 1 ) 3 -Si ```where R 1 is C 1-12 hydrocarbyl radical ```D is R 1 R 2 SiO 2/2 where R 2 is as R 1 ```D 1 is R 1 ArSiO 2/2 where Ar is an aromatic hydrocarbyl radical. The titanate ester is of formula Ti(OR 4 ) 4 where R 4 is a C 1-20 hydrocarbyl radical. The silicate ester is of formula ArSi(OR 4 ) 3 where R 4 and Ar are as above.
申请公布号
DE19625563(A1)
申请公布日期
1997.01.02
申请号
DE19961025563
申请日期
1996.06.26
申请人
GENERAL ELECTRIC CO., SCHENECTADY, N.Y., US
发明人
WARD, BRIAN JOHN, VALLEY FALLS, N.Y., US;SMITH, ROBERT AUGUSTINE, CLIFTON PARK, N.Y., US;STRIKER, RICHARD ALBERT, RENSSELAER, N.Y., US