The coil assembly for a transponder is produced in a form suitable for being implemented as a surface mounted arrangement on the conducting surface S of a carrier substrate B. The transponder electronic modules V are connected via the surface tracks to the coil A that has contact points C at each end. The modules contain a modulator, a demodulator, memory etc to provide the required ac supply.
申请公布号
DE19523521(A1)
申请公布日期
1997.01.02
申请号
DE19951023521
申请日期
1995.06.30
申请人
LICENTIA PATENT-VERWALTUNGS-GMBH, 60596 FRANKFURT, DE