Lapping process for a single element magnetoresistive head

摘要

A method of lapping magnetoresistive (MR) heads individually which provides an MR element having a desired height with minimized skew is described. During fabrication of the MR head, one or more shunt resistors are formed between the edge of the MR element and the head air bearing surface. The shunt resistors are electrically connected at each end to extensions of the MR electrical leads and connected to the MR element and to each other at points between the ends forming a resistor network. During lapping of the MR head, the resistance of the resistor network is measured by an Ohmmeter connected between the MR element leads. As portions of the shunt resistors are ground away, the changes in the measured resistance of the resistor network are used to monitor and control any skew in the lapping process.