| 发明名称 |
Menetelmä ja järjestely komponentin lämmittämiseksi |
| 摘要 |
The invention relates to a method and arrangement for heating at least one component (14) of a circuit board comprising one or plural layers (10 and 11). At least one component (14) to be heated is then heated with at least one heat resistor (15) associated with the circuit board. |
| 申请公布号 |
FI965301(A0) |
申请公布日期 |
1996.12.31 |
| 申请号 |
FI19960005301 |
申请日期 |
1996.12.31 |
| 申请人 |
NOKIA TELECOMMUNICATIONS OY |
发明人 |
ISTERI, ARI |
| 分类号 |
H05B3/68;H01L23/34;H05K1/02;H05K1/16;H05K3/46;H05K7/20;(IPC1-7):H05K |
主分类号 |
H05B3/68 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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