| 摘要 |
PCT No. PCT/JP93/00853 Sec. 371 Date Feb. 17, 1994 Sec. 102(e) Date Feb. 17, 1994 PCT Filed Jun. 24, 1993 PCT Pub. No. WO94/00800 PCT Pub. Date Jan. 6, 1994The present invention provides a photosensitive resin composition into which a photosensitive group can be easily given and introduced and which is excellent in conservation, stability, heat resistance, practical physical properties and sensitivity and which can inhibit cracks from occurring at the time of development. The photosensitive resin composition of the present invention comprises 100 parts by weight of a polyimide, 10-100 parts by weight of an isocyanurate having a (meth)acrylic group, 10-100 parts by weight of a polyalkylene glycol di(meth)acrylate, and 0.5-20 parts by weight of a photopolymerization initiator. This composition can be utilized to obtain a patterned polyimide film having heat resistance. This composition can be applied to uses of electronic materials such as interlayer films of multi-layer boards of printed-wiring boards, and the like.
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