发明名称 |
Apparatus for full wafer deposition |
摘要 |
The present invention provides a shield arrangement that prevents deposition in the area of the chamber surrounding the substrate. This shield arrangement is equipped with a wall-like member which surrounds a substrate, and includes a projecting annular flange and a substrate support which extends in the horizontal direction beyond the substrate, and includes a groove therein. The annular flange is received in the groove to shield the deposition region of the chamber from the remainder of the chamber.
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申请公布号 |
US5589224(A) |
申请公布日期 |
1996.12.31 |
申请号 |
US19940310617 |
申请日期 |
1994.09.22 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TEPMAN, AVI;JINBO, TAKESHI;TAKAHAMA, HIROYUKI;SAITO, AKIHIKO |
分类号 |
C23C16/44;C23C16/458;(IPC1-7):C23C16/00 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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