| 摘要 |
<p>A semiconductor device structure for reliable semiconductor devices suffering less changes in their connection resistance in a long environmental test period, while reducing the manufacturing cost of the package including the chip. In the manufacture of a semiconductor device using a face-down semiconductor chip, metal bumps are formed on the substrate instead of those on the bonding pad of the chip, the entire chip surface is bonded with an organic, anisotropic conductive organic adhesive, and the entire or a part of the back face of the chip including at least the edges is covered with a sealing material.</p> |
