发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC PARTS
摘要 <p>A method and a device for mounting electronic parts on an electronic circuit board. The method includes a mounting step of taking out electronic parts (10) from a parts holding section (6) and mounting the electronic parts (10) on an electronic circuit board (5) and a machining step of machining the parts (10) so that their characteristic values are predetermined ones at the above-mentioned mounting step. The kind of electronic parts (10) arranged in a parts housing section (6) is reduced, and the facility cost and the management cost of the parts (10) are reduced accordingly.</p>
申请公布号 WO1996042189(P1) 申请公布日期 1996.12.27
申请号 JP1996001529 申请日期 1996.06.06
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