| 摘要 |
FIELD: electronic engineering. SUBSTANCE: crystal oscillator has external hermetically sealed casing accommodating printed-circuit board with through slits over its thickness that divide it into two segments interconnected by means of jumpers. All thermostatically controlled components of crystal oscillator circuit, such as quartz-crystal resonator, varicap, and others, as well as temperature sensor and heater, are mounted on one segment and all those not controlled thermostatically, such as self-excited oscillator, power supply, amplifier, and the like, as well as printed-circuit board fastenings securing it to casing, are installed on other segment. Components placed on different segments are interconnected by means of thin wires of low heat conductance metal. Total width of jumpers is 0.01-0.2 of total length of slits. Free spaces of casing are filled with low-heat-conductance gases, such as xenon. Crystal oscillator manufacturing process involves dividing printed-circuit board into two segments by means of above-mentioned slits and interconnecting them by means of jumpers. Then oscillator circuit components are mounted on respective segments, board is placed in casing on plug-in pins which are secured on one of segments. Then external casing is sealed and filled with xenon. EFFECT: improved design, facilitated manufacture. |
