发明名称 LOW TEMPERATURE SINTERED, RESISTIVE ALUMINUM NITRIDE CERAMICS
摘要 <p>An aluminum nitride ceramic having enhanced properties suitable for electronic packaging applications can be prepared from a synergistic aluminum nitride powder/sintering aid mixture, in which the sintering aid is formulated to provide a resultant desirable second phase within the sintered body. The aluminum nitride powder/sintering aid mixture can be formed into green sheet-metal laminates and sintered at low temperature to yield high density, high electrical resistivity, and high thermal conductivity metal ceramic sintered bodies with low camber.</p>
申请公布号 WO1996041777(A1) 申请公布日期 1996.12.27
申请号 US1996010153 申请日期 1996.06.12
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