| 摘要 |
A plastic container for handling, storing and shipping semiconductor wafers comprising a wafer carrier supporting the wafers and maintaining the wafers in spaced relation to each other, a plurality of rows of resiliently flexible tabs of progressively increasing and decreasing widths formed on the partially cylindrical top and bottom surfaces of the wafer carrier, the top and bottom surfaces formed of stiff but resiliently flexibly yieldable material, supporting ribs on the bottom surface extending longitudinally of the bottom and parallel to the rows thereon, the width of the tabs being shorter at the ends of the rows and wider in the middle to engage and maintain the edges of the wafers spaced from the top and bottom surfaces while allowing for flexing and bowing of the top and bottom surfaces from the pressure of the covers and weight of the wafers.
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