| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball grid array package, by which the thermal performance of an electronic constituent component is enhanced and fatigue of solder balls is reduced and which has a ceramic chip carrier with a circuit. SOLUTION: A package 30 has a heat sink 34 and a plurality of ceramic constituent component carriers 36 bonded to the heat sink 34. An integrated circuit chip or the other electronic constituent component 32 is also bonded to the region, which is located between the carriers 36 of the heat sink. The electronic constituent component is electrically connected with the conductive paths in the carriers 36. Each conductive path comes into contact electrically with solder balls or soluble conductors 38 on at least one surface of each carrier 36. By such a ball grid array package, the thermal performance of the electronic constituent component is enhanced, fatigue of the solder balls is reduced, and stresses between the carrier 36 and the metallic heat sink is decreased. |
