发明名称 RESIN COMPOSITION FOR MOLDING DIE, MOLDING DIE AND MOLDING OF MATERIAL WITH THE DIE
摘要 PURPOSE: To obtain a resin composition which easily and accurately gives molding die parts through machining without requiring a master model by compounding a thermosetting resin, an inorganic fibrous reinforcing material and an inorganic particulate filler so as to provide specified properties. CONSTITUTION: This composition consists of a themosetting resin (e.g. vinyl ester resin) preferably in an amount of 25-70wt.%, an inorganic fibrous reinforcing material (e.g. potassium titanate whisker) preferably having a mean fiber diameter of at most 5μm, an aspect ratio of at least 3 and a Mohs hardness of at most 6, preferably in an amount of 15-50wt.%, and an inorganic particulate filler (e.g. calcium carbonate) preferably having a mean particle diameter of at most 20μm and a Mohs hardness of at most 6, preferably in an amount of 10-50wt.%, and it has a flexural strength of at least 1,000kgf/cm<2> , a flexural modulus of at least 70,000kgf/cm<2> and machinable properties. The core 2 and cavity 1 of a molding die A are formed from the composition.
申请公布号 JPH08337685(A) 申请公布日期 1996.12.24
申请号 JP19950143785 申请日期 1995.06.12
申请人 OTSUKA CHEM CO LTD 发明人 TASAKA TAKIO;TSUJIKAWA YOSABURO;SAKANE KOJI;ICHIKAWA YASUHIKO
分类号 B29C33/40;B29C45/26;B29K101/10;B29K101/12;C08K7/00;C08K7/02;C08K7/04;C08L101/00;(IPC1-7):C08K7/02 主分类号 B29C33/40
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