| 摘要 |
<p>PURPOSE: To suppress the formation of cavities and development of warps, cracks, etc., by burying a thermosetting synthetic resin which does not remelt until the surface of the resin becomes flush with the front ends of inner leads in the surface of a semiconductor chip between the front ends of adjacent inner leads. CONSTITUTION: A rectangular semiconductor chip 12 is formed of a silicon semiconductor substrate. A plurality of inner leads 13 arranged along the long side of the chip 12 is fixed to the upper surface of the chip 12. The leads 13 are made of Cu or an Ni-Fe alloy and arranged at 0.1-3.0mm intervals. For fixing the front end sections 13a of the leads 13 to the upper surface of the chip 12, a polyimide adhesive tape 14 is used. The front end sections 13a are respectively connected to pads 15 through bonding wires 16. A burying agent 17 composed of a thermosetting resin is buried and a package 18 is formed by injection-molding a synthetic resin for setting and sealing. Therefore, the development of cavities and cracks can be prevented.</p> |
