| 摘要 |
<p>PURPOSE: To obtain an IC card, which can cope with systemization and multifunctionalization, by a method wherein both the sides of a frame, in which a board mounted with electron parts is provided, are covered with two panels under the condition that a first connector is mounted at one end of the frame and a second connector is mounted on the main surface of one panel. CONSTITUTION: Within a resin frame 3 pinched between metal panels 4a and 4b, a board 9, on which electron parts 8 including various, ICs such as a memory, a CPU and the like and sub-connectors 50 and 51. are mounted, is mounted. Further, the resin frame 3 holds a main connector 2 for exchanging signals between system appliances and the card. The drawn part at the periphery of the metal panel 4a and the metal panel 4b are fixed through bonding sheets 10 to the resin frame 3 under the state that the main connector 2 and the board 9 locate between the panels 4a and 4b. Furthermore, a resin base 6b is provided between the metal panel. 4a and the board 9 so as to constitute an outer frame, in which connecting sub-connectors 50 and 51 are inserted, together with a resin cover 6a.</p> |
