| 摘要 |
PROBLEM TO BE SOLVED: To uniformly polish by arranging conduits in a support matrix so that the center of a longitudinal axis of the conduit and the working surface of a polishing pad form a desired angle. SOLUTION: An angle between the longitudinal centerline 222 of a cylindrical tube 210 and the working surface 216 of a polishing pad 200 is set into a range of about 60 deg. to about 120 deg.. The charging density of the cylindrical tubes 210 in the polishing pad 200 is adjusted to provide liquid flow volume to the pad surface and to provide the desired quantity of void space for treating slurry or reactive etchant material, and the total polishing degree desirable for the polishing pad 200 is provided depending on the relative hardness of the cylindrical tube 210 to the hardness of a surrounding support matrix 220. |
