发明名称 Method of bonding metal to a non-metal substrate
摘要 A method of bonding metal to a non-metal substrate. The process includes placing the metal in contact with a non-metal substrate and blanketing the contact region with a gaseous atmosphere in which the amount of reactive gas is limited to minimize oxidation of the metal at the surface. Heating of the metal is accomplished by various means including a laser beam. The metal is heated to a point where the reactive gas and metal form a eutectic that wets the contact area between the metal and non-metallic substrate. Upon cooling, the metal and non-metallic substrate are bonded together over a substantial part of the contact area.
申请公布号 US5586714(A) 申请公布日期 1996.12.24
申请号 US19940319014 申请日期 1994.10.06
申请人 BOARD OF REGENTS OF THE UNIVERSITY OF NEBRASKA 发明人 CURICUTA, VICTOR;ALEXANDER, DENNIS R.;DEANGELIS, ROBERT J.;ROBERTSON, BRIAN W.
分类号 B23K26/12;B23K26/32;C04B37/02;(IPC1-7):B23K26/00 主分类号 B23K26/12
代理机构 代理人
主权项
地址