发明名称 |
Method of bonding metal to a non-metal substrate |
摘要 |
A method of bonding metal to a non-metal substrate. The process includes placing the metal in contact with a non-metal substrate and blanketing the contact region with a gaseous atmosphere in which the amount of reactive gas is limited to minimize oxidation of the metal at the surface. Heating of the metal is accomplished by various means including a laser beam. The metal is heated to a point where the reactive gas and metal form a eutectic that wets the contact area between the metal and non-metallic substrate. Upon cooling, the metal and non-metallic substrate are bonded together over a substantial part of the contact area.
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申请公布号 |
US5586714(A) |
申请公布日期 |
1996.12.24 |
申请号 |
US19940319014 |
申请日期 |
1994.10.06 |
申请人 |
BOARD OF REGENTS OF THE UNIVERSITY OF NEBRASKA |
发明人 |
CURICUTA, VICTOR;ALEXANDER, DENNIS R.;DEANGELIS, ROBERT J.;ROBERTSON, BRIAN W. |
分类号 |
B23K26/12;B23K26/32;C04B37/02;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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