LEAD FRAME AND SEMICONDUCTOR DEVICE USING IT

摘要

PURPOSE: To provide a lead frame which can be simplified in structure and can reduce the length of wiring and number of connecting points and a semiconductor device using the lead frame. CONSTITUTION: A semiconductor chip 19 is mounted on the die pad 15 of a lead frame 18 in which the die pad 15 and very thin post-like bumps 14 are formed on a metallic frame by using an etching technique and fixed with a resin so that their both end faces can be exposed and electrodes on the chip 19 are connected to the pad 15 of the lead frame 18 through bonding wires 20. Then the chip 19 and wires 20 are encapsulated with a molding resin 21.