摘要 |
The object of the invention is to provide a piezoelectric bending transducer in which inherent bending brought about by heat is prevented when the transducer is subjected to thermal stress. According to the invention, this object is achieved in that the bending transducer (2, 12, 14) has a piezoceramic layer (6, 8) applied to a carrier layer (4, 16, 18) and the materials of the piezoceramic layer (6, 8) and of the carrier layer (4, 16, 18) have substantially identical coefficients of thermal expansion. |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;STEIN, CHRISTIAN;MOECKL, THOMAS;RIEDEL, MICHAEL |
发明人 |
STEIN, CHRISTIAN;MOECKL, THOMAS;RIEDEL, MICHAEL |