| 摘要 |
<p>The invention relates to a multilayer module for packaging of at least one electronic component (50), such as an integrated circuit chip, said module comprising a plurality of layers of thickfilm and said module having a wiring structure (45) for the connection of at least one on-module capacitor characterized in that said wiring structure comprises a partial mesh plane (46, 47, 48, 49) between the topmost and the second topmost of said layers of thickfilm.</p> |
