LOW INDUCTANCE ELECTRICAL GROUND CONNECTION INTEGRATED CIRCUIT DIE PACKAGE

摘要

A low inductance electrical ground connection for an integrated circuit die package (100) including a lead frame ground pin (116) electrically coupled to a ground plane (118) at two distinct locations along the ground pin to thereby establish two parallel electrical ground current flow paths, a first path involving only the ground pin (116) and a second path involving both the ground pin (116) and the ground plane (118).