发明名称 |
MESH PLANES FOR MULTILAYER MODULE |
摘要 |
The invention relates to a multilayer module for packaging of at least one electronic component (50), such as an integrated circuit chip, said module comprising a plurality of layers of thickfilm and said module having a wiring structure (45) for the connection of at least one on-module capacitor characterized in that said wiring structure comprises a partial mesh plane (46, 47, 48, 49) between the topmost and the second topmost of said layers of thickfilm. |
申请公布号 |
WO9641376(A1) |
申请公布日期 |
1996.12.19 |
申请号 |
WO1995EP02194 |
申请日期 |
1995.06.07 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;GARBEN, BERND;FRECH, ROLAND;KLINK, ERICH;HARRER, HUBERT |
发明人 |
GARBEN, BERND;FRECH, ROLAND;KLINK, ERICH;HARRER, HUBERT |
分类号 |
H01L25/00;H01L23/522;H01L23/538;H05K1/03;H05K1/09;H05K1/16 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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