| 摘要 |
A semiconductor device includes a semiconductor substrate forming the bottom portion of a package of the device and a ceramic plate forming the upper or lid portion of the device. The substrate includes a layer of metal on its upper surface along the substrate outer edge and spaced apart from electrodes on the substrate upper surface. The ceramic plate includes a copper foil on its lower surface along the outer edge thereof which overlaps and is bonded to the substrate metal layer. The ceramic plate has apertures therethrough which are sealed by copper foils on the inside of the package, the foils being bonded to respective ones of the substrate electrodes. A method of assembly comprises forming an array of integrally connected lids and an army of integrally connected substrates, each of the arrays including the aforementioned layers and foils, bonding the arrays together to form an array of devices, and dicing the bonded together arrays to provide individual devices.
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