发明名称 LEAD FRAME
摘要 <p>PURPOSE: To prevent disconnection of an inner lead and a bonding wire by forming the width of one surface of a lead narrower than the width of the other surface or forming the width of the latter narrower than the width of the former and providing a part whose cross sectional contour is approximately trapezoid to one or more positions alternately. CONSTITUTION: A part wherein the width of the upper surface of an inner lead 7 is narrower than the width of the lower surface and a cross sectional contour is approximately trapezoid or a part wherein the width of the lower surface of the inner lead 7 is narrower than the width of the upper surface and a cross sectional contour is approximately trapezoid is formed in an arbitrary region Z inside a mold area or outside a plating area X of the inner lead 7. The parts can be provided in a plurality of places when the occasion demands; in the case, it is desirable to form a cross sectional contour alternately. Adhesion between resin after resin mold and a lead frame is improved. Thereby, disconnection of an inner lead and a bonding wire and cracks of resin can be prevented.</p>
申请公布号 JPH08335659(A) 申请公布日期 1996.12.17
申请号 JP19950139599 申请日期 1995.06.06
申请人 TOPPAN PRINTING CO LTD 发明人 KAWASHIMA KATSUMASA
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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