发明名称 Composition dispensable at high speed for bonding electric parts to printed wiring boards
摘要 A liquid epoxy resin composition is disclosed which comprises a liquid epoxy resin, an amine curing agent, an inorganic filler such as calcined talc, and an organic rheology additive such as modified castor oil. The epoxy resin composition having not greater than 0.4 of an R-value defined by the following equation:R= eta 10/Scwherein eta 10 is a viscosity in Pa.s of the composition at a rate of shear of 10 sec-1 and Sc represents a Casson yielding point shows excellent adaptability to a high speed dispenser.
申请公布号 US5585421(A) 申请公布日期 1996.12.17
申请号 US19950413866 申请日期 1995.03.29
申请人 SOMAR CORPORATION 发明人 KAWANO, TAKAYUKI;MINAMOTO, HIROAKI;NAGASE, RIHEI
分类号 C08K3/34;C08K5/103;C08K5/16;C08L63/00;H05K3/30;(IPC1-7):C08L63/00;C08L77/00 主分类号 C08K3/34
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