发明名称 |
Composition dispensable at high speed for bonding electric parts to printed wiring boards |
摘要 |
A liquid epoxy resin composition is disclosed which comprises a liquid epoxy resin, an amine curing agent, an inorganic filler such as calcined talc, and an organic rheology additive such as modified castor oil. The epoxy resin composition having not greater than 0.4 of an R-value defined by the following equation:R= eta 10/Scwherein eta 10 is a viscosity in Pa.s of the composition at a rate of shear of 10 sec-1 and Sc represents a Casson yielding point shows excellent adaptability to a high speed dispenser.
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申请公布号 |
US5585421(A) |
申请公布日期 |
1996.12.17 |
申请号 |
US19950413866 |
申请日期 |
1995.03.29 |
申请人 |
SOMAR CORPORATION |
发明人 |
KAWANO, TAKAYUKI;MINAMOTO, HIROAKI;NAGASE, RIHEI |
分类号 |
C08K3/34;C08K5/103;C08K5/16;C08L63/00;H05K3/30;(IPC1-7):C08L63/00;C08L77/00 |
主分类号 |
C08K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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