发明名称 |
Semiconductor module with an improved heat sink/insulation plate arrangement |
摘要 |
A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.
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申请公布号 |
US5585672(A) |
申请公布日期 |
1996.12.17 |
申请号 |
US19950443453 |
申请日期 |
1995.05.18 |
申请人 |
HITACHI, LTD. |
发明人 |
KOIKE, YOSHIHIKO;SAITO, RYUICHI;SEKINE, SIGEKI;WAKISAWA, YUUJI |
分类号 |
H01L23/373;H01L25/07;H01L25/18;(IPC1-7):H01L23/10;H01L23/34 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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