| 摘要 |
PURPOSE: To realize easy high density mounting and improvement of reliability. CONSTITUTION: Since a bare chip 13 is coated with a filmy member 12 with insulating resin 14B between, a semiconductor device can be formed to almost the same size as the bare chip 13 as a whole and the bare chip 13 can be mechanically and electrically protected during wiring board mounting. The bare chip 13 is mounted on one surface 12B of the filmy member 12, the insulation resin 14B is filled between the bare chip 13 and the filmy member 12 and the bare chip 13 is coated with the filmy member 12 successively. Thereby, a semiconductor device which is almost the same size as the bare chip 13 and can protect the bare chip 13 by the insulation resin 14B and the filmy member 12 can be manufactured. |
